The **ATS-14B-41-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS)** push-pin heat sink designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table summarizes the primary mechanical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Dimensions** | 40mm x 40mm x 22.9mm | | **Thermal Resistance** | 10.02°C/W @ 100 LFM | | **Fin Style** | Straight Fin (Max airflow efficiency) | | **Compliance** | RoHS Compliant | --- ### 2. Breakdown of Components An electronic cooling assembly like the ATS-14B-41-C2-R0 consists of several integrated parts: #### A. The Heat Sink Body * **Geometry:** It features a 40mm square base with a 22.9mm height. * **Fin Design:** The vertical fins increase the surface area available for heat dissipation. The "C2" indicates the specific fin density and configuration optimized for longitudinal airflow. * **Finish:** The Blue Anodized coating not only provides a professional look but also enhances radiation heat transfer and prevents corrosion. #### B. The Push-Pin Fasteners * **Mechanism:** Two plastic push-pins are located at diagonal corners. * **Function:** These pins snap into pre-drilled holes in the PCB (Printed Circuit Board). This ensures a secure, vibration-resistant connection that maintains constant pressure between the heat sink and the chip. #### C. The Compression Springs * **Pressure Management:** The springs sit on the push-pins to provide a specific "clamping force." This is critical because it ensures the **Thermal Interface Material (TIM)** is compressed correctly without cracking the delicate silicon die. --- ### 3. Application Use Cases This specific part is typically used in environments where active or passive airflow is present, such as: * **Networking Equipment:** Routers, switches, and gateways. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Processors:** Low-to-mid TDP (Thermal Design Power) BGA components. --- ### 4. Thermal Performance Comparison Thermal resistance ($R_{th}$) determines how efficiently the part moves heat away from the component. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.02 | | 200 (1.0 m/s) | 4.93 | | 300 (1.5 m/s) | 3.54 | | 400 (2.0 m/s) | 2.85 | ---