The **ATS-14B-63-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** from the "maxiFLOW" series manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its specifications and design features. --- ### 1. Technical Specifications | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-14B-63-C2-R0 | | **Series** | maxiFLOW™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 2.85°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 40.00mm x 20.00mm | --- ### 2. Design Characteristics #### A. maxiFLOW™ Fin Geometry The "maxiFLOW" design is characterized by a spread-fin pattern. Unlike standard square fin heat sinks, this geometry: * Reduces pressure drop across the component. * Maximizes surface area for convective heat transfer. * Is ideal for high-velocity airflow environments. #### B. pushPIN™ Attachment The "14B" designation indicates the use of the **pushPIN™** mounting system. * **Hardware:** It typically includes a brass or plastic pin with a stainless steel spring. * **Pressure:** The spring provides precise, uniform pressure on the component (CPU, GPU, or FPGA), ensuring optimal interface with the Thermal Interface Material (TIM). #### C. Material and Coating * **Aluminum 6063:** Provides a good balance between thermal conductivity, weight, and cost. * **Blue Anodized Finish:** This is not just aesthetic; anodization protects the aluminum from corrosion and slightly increases the emissivity of the surface, aiding in radiative heat transfer. --- ### 3. Thermal Performance (Typical Data) The efficiency of this heat sink depends on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) - Unducted | |:---|:---| | 200 (1.0 m/s) | 2.85 | | 400 (2.0 m/s) | 1.80 | | 600 (3.0 m/s) | 1.45 | --- ### 4. Application Use Cases This specific part is commonly found in: * **Networking Equipment:** Switches and routers where high-density components generate significant heat. * **Power Supplies:** Cooling MOSFETs or power transistors. * **Embedded Computing:** Cooling industrial-grade processors.