The **ATS-14B-65-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing the cooling element directly to a Printed Circuit Board (PCB). --- ### Technical Specifications The following table summarizes the key electrical and physical parameters of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Base Part Number** | ATS-14B-65-C2-R0 | | **Thermal Resistance** | 7.29°C/W (Unducted Flow @ 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Fin Type** | Square Fin (Cross-cut) | | **Dimensions (L x W x H)** | 45mm x 45mm x 24.5mm | --- ### Key Components & Design Features #### 1. Material and Coating * **Aluminum Construction:** Offers a balance of lightweight properties and high thermal conductivity. * **Blue Anodized Finish:** The surface treatment is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, which slightly improves radiative heat transfer. #### 2. Fin Geometry (Cross-Cut) * The heat sink features a **Square Fin** pattern. Unlike straight fins, cross-cut fins allow for multi-directional airflow. This makes it ideal for dense PCB environments where the direction of the system fan's airflow might be obstructed or turbulent. #### 3. Attachment Mechanism: Push-Pin & Spring * **Push-Pin:** This model uses a plastic or brass push-pin that snaps into pre-drilled holes on the PCB. * **Spring-Loaded:** A compression spring provides consistent pressure (interface pressure) between the heat sink and the electronic component (CPU, FPGA, or GPU). This ensures that the Thermal Interface Material (TIM) works efficiently. #### 4. Thermal Performance The performance of this heat sink is highly dependent on the velocity of the air provided by system fans: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 7.29 | | 300 (1.5 m/s) | 2.36 | | 500 (2.5 m/s) | 1.67 | --- ### Applications This part is commonly used to cool: * **ASICs and FPGAs:** Used in networking and telecommunications equipment. * **Processors:** Low-to-mid power CPUs in embedded systems. * **Power Electronics:** High-heat generating transistors or power modules.