The **ATS-14B-69-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific naming convention that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-14B-69-C2-R0 | | **Heat Sink Type** | Push-Pin (Passive cooling) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 11.31°C/W (at 1.0 m/s airflow) | | **Dimensions** | 45mm x 45mm x 20mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | --- ### 2. Key Component Features #### A. Fin Design: "maxiFLOW™" The "69" series utilizes ATS’s proprietary **maxiFLOW™** fin geometry. Unlike standard square fins, these are flared out to increase the surface area for maximum heat dissipation while maintaining a low pressure drop. #### B. Attachment Mechanism (Push-Pins) The "B" in the part number indicates the attachment style: * **Push-Pins:** It uses pre-assembled nylon or brass push-pins with a compression spring. * **PCB Mounting:** Requires specific hole patterns (3.2mm holes) drilled into the PCB around the component. * **Reliability:** Provides constant pressure for better thermal interface contact compared to adhesive tapes. #### C. Thermal Interface Material (TIM) The **"C2"** suffix indicates that this part comes pre-applied with high-performance **Thermal Interface Material**. This ensures there are no air gaps between the heat-generating component and the aluminum heat sink. --- ### 3. Usage Context This part is typically used in industrial and high-reliability electronics where heat must be managed to prevent "thermal throttling" or hardware failure. * **Target Components:** Large BGA (Ball Grid Array) packages. * **Environment:** Forced air environments (where fans are present to push air through the fins). * **Industries:** Telecommunications, high-end networking, and embedded computing. ---