The **ATS-14B-70-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for secure and efficient cooling of electronic components like CPUs, GPUs, and FPGAs. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 14.15°C/W (at 200 LFM) | | **Dimensions** | 45mm x 45mm x 25mm | | **Fin Style** | Straight Fin (High Flow) | --- ## Key Components & Construction ### 1. The Heat Sink Body The body is constructed from **Aluminum 6063**, which offers high thermal conductivity while remaining lightweight. The blue anodized finish is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiation cooling. ### 2. Push-Pin Attachment System Unlike adhesive-based heat sinks, the **ATS-14B-70-C2-R0** uses a mechanical push-pin system. This consists of: * **Plastic Pins:** Designed to fit into pre-drilled holes (typically 3mm) on the PCB. * **Compression Springs:** These apply a precise amount of downward pressure on the electronic chip, ensuring a consistent interface with the thermal grease or pad. ### 3. Fin Geometry It utilizes a **Straight Fin** design. This is optimized for systems with a clear "line of sight" for airflow. It provides a lower pressure drop compared to cross-cut designs, making it ideal for high-velocity air cooling environments. --- ## Thermal Performance Data Performance varies based on the Airflow Velocity (Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 14.15 | | **400 (2.0 m/s)** | 6.00 | | **600 (3.0 m/s)** | 4.40 | --- ## Applications This part is commonly used in the following electronic sectors: * **Telecommunications:** Cooling network switches and routers. * **Embedded Systems:** Industrial PCs and high-load controllers. * **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators.