The **ATS-14B-79-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS)** push-pin heatsink designed for cooling integrated circuits (ICs) and other electronic components. ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-14B-79-C2-R0 | | **Heatsink Type** | Push-Pin (Passive/Active Air Cooling) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 26.32° C/W (@ 100 LFM) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions** | 25mm x 25mm x 30mm | --- ### 2. Physical Design and Construction * **Fin Style:** This model features **Straight Fins**. Straight fin designs are optimized for unidirectional airflow, allowing heat to be carried away efficiently from the baseplate through the vertical channels. * **Material:** It is made from high-grade aluminum. The **"C2"** in the part number indicates a blue anodized finish, which provides surface protection and slightly improves radiant heat emissivity. * **Interface:** It typically comes with **Pre-applied Thermal Interface Material (TIM)**, which ensures there are no air gaps between the component (CPU/GPU/SoC) and the heatsink base. --- ### 3. Electronic Attachment Mechanism (Push-Pin) The **R0** suffix refers to the specific attachment hardware used to secure the heatsink to the Printed Circuit Board (PCB): 1. **Brass Push-Pins:** These pins are inserted through pre-drilled holes in the PCB. 2. **Compression Springs:** Every pin is equipped with a spring to provide precise, uniform pressure across the component. This prevents "tilting" which can crack delicate silicon dies. 3. **Stability:** Unlike adhesive-based heatsinks, push-pins offer superior mechanical stability in high-vibration environments (e.g., industrial machinery or automotive electronics). --- ### 4. Typical Applications This specific size (25mm footprint) is commonly used for: * **Network Switches/Routers:** Cooling ASICs and Processors. * **Power Supplies:** Heat dissipation for MOSFETs or Voltage Regulators. * **Embedded Systems:** Cooling small-form-factor industrial computers. ---