The **ATS-14B-91-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the *maxiFLOW* series manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its electronic and mechanical specifications. --- ### 1. General Specifications This part is designed for cooling high-heat-generating electronic components such as CPUs, GPUs, FPGAs, or power transistors. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-14B-91-C2-R0 | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Material** | Aluminum (with Blue Anodized finish) | --- ### 2. Thermal Performance Thermal resistance determines how effectively the heat sink transfers heat away from the component into the surrounding air. Lower values indicate better cooling performance. | Airflow Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted Flow (100 LFM)** | 21.97 | | **Ducted Flow (200 LFM)** | 10.19 | | **Ducted Flow (400 LFM)** | 5.33 | | **Ducted Flow (600 LFM)** | 4.10 | --- ### 3. Physical Dimensions The physical footprint is critical for ensuring compatibility with the Printed Circuit Board (PCB) layout. * **Length (A):** 40.00 mm * **Width (B):** 40.00 mm * **Height (C):** 10.00 mm * **Hole Spacing (E):** 33.00 mm * **Hole Spacing (F):** 33.00 mm --- ### 4. Key Electronic Applications This heat sink is typically used in the following electronic environments: * **Telecommunications:** Cooling of high-speed network switches. * **Computing:** Secondary cooling for voltage regulator modules (VRMs). * **Power Electronics:** Dissipating heat from MOSFETs or IGBTs. * **Industrial Controls:** Used in automation hardware where space is limited but thermal loads are high. --- ### 5. Mounting Mechanism (pushPIN™) The "R0" designation refers to the specific mounting hardware. * **Compression Springs:** Ensure even pressure across the electronic component for maximum thermal contact. * **Tool-less Install:** Designed for rapid assembly in manufacturing environments. * **Security:** Provides a secure fit that resists vibration and mechanical shock.