The **ATS-14B-93-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** designed by Advanced Thermal Solutions (ATS) for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 7.37°C/W (@ 100 LFM) | | **Flow Orientation** | Straight Fin | --- ### 2. Key Component Breakdown #### A. The pushPIN™ Attachment System Unlike adhesive tapes or simple clips, the "14B" series utilizes the **pushPIN™** mechanism. This provides: * **Constant Pressure:** A high-performance compression spring ensures uniform pressure across the component surface for maximum heat transfer. * **Secure Mounting:** It mounts through pre-drilled holes in the PCB, making it resistant to shock and vibration. #### B. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodize:** The coating is not just aesthetic; it provides corrosion resistance and increases surface emissivity, slightly improving radiant heat transfer. #### C. Straight Fin Design The "93" in the part number corresponds to the specific fin geometry. Straight fins are ideal for **unidirectional airflow** environments, such as those found in server racks or desktop cases where fans blow air in a fixed path. --- ### 3. Part Number Decoder The nomenclature for the ATS-14B-93-C2-R0 is structured as follows: | Segment | Meaning | | :--- | :--- | | **ATS-14** | Series (pushPIN™ Aluminum Heat Sink) | | **B** | Attachment Style (Plastic/Brass Push-Pin) | | **93** | Specific Fin Profile and Dimensions | | **C2** | Thermal Interface Material (T766 Phase Change Material) | | **R0** | RoHS Compliant / Revision Status | --- ### 4. Application Use Cases This part is typically used for cooling: * **Processors (CPUs/GPUs):** Low-to-mid TDP chips. * **FPGAs & ASICs:** High-speed logic gates that generate localized heat. * **Northbridge/Southbridge:** Chipsets on industrial motherboards.