ATS-14B-95-C2-R0
AI

The **ATS-14B-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the "blue ICE" series designed for cooling electronic components like CPUs, GPUs, and power modules.
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### 1. Technical Specifications
The following table highlights the critical dimensions and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 40mm x 40mm x 25mm |
| **Fin Style** | Straight Fin (Extruded) |
| **Thermal Resistance** | 7.29°C/W (at 200 LFM) |
| **Attachment Method** | pushPIN™ |
| **Spring Type** | Brass (standard) |
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### 2. Key Design Features
#### A. pushPIN™ Attachment System
The "14B" in the part number indicates the use of ATS’s proprietary **pushPIN™** mounting system.
* **Stability:** It ensures precise pressure is applied to the component, optimizing thermal transfer.
* **Ease of Install:** Uses a spring-loaded mechanism that snaps into pre-drilled holes on the PCB.
#### B. Material and Coating
* **Aluminum Construction:** Provides a balance between high thermal conductivity and low weight.
* **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides corrosion resistance and slightly improves heat radiation (emissivity) compared to raw aluminum.
#### C. Straight Fin Profile
The straight-fin design is optimized for **forced air cooling** (active airflow from fans). It allows air to pass through the channels with minimal pressure drop, making it ideal for high-density electronic enclosures.
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### 3. Application Use Cases
The ATS-14B-95-C2-R0 is typically used in environments where electronic components generate significant heat in a small footprint:
* **Telecommunications:** Cooling of high-speed processors in network switches.
* **Embedded Systems:** Industrial PCs and automation controllers.
* **Power Electronics:** Voltage regulators and power supplies.
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- ⤷
What are the specific PCB hole requirements for the pushPIN mounting system?
- ⤷ How does the thermal resistance change at higher airflow speeds like 500 LFM?
- ⤷ Is there a version of this heat sink available with a Phase Change Material (PCM) interface?