The **ATS-14B-97-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It is manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. Below is a detailed breakdown of its specifications and features. --- ### 1. Technical Specifications The part belongs to the **pushPIN™** series, designed for easy installation and high thermal efficiency. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height (Height Off Base)** | 10.00 mm | | **Pitch** | 3.80 mm | | **Hole Pattern** | Square | --- ### 2. Thermal Performance Thermal resistance is critical for preventing component failure. The performance varies based on the airflow (Velocity) provided by the system fans. | Air Velocity (LFM) | Thermal Resistance (Unducted) | Thermal Resistance (Ducted) | | :--- | :--- | :--- | | 100 (0.5 m/s) | 20.30 °C/W | 3.60 °C/W | | 300 (1.5 m/s) | 8.10 °C/W | 2.10 °C/W | | 500 (2.5 m/s) | 5.30 °C/W | 1.60 °C/W | --- ### 3. Key Electronic Components Features * **Fin Design (Straight Fin):** The "97" in the part number indicates a specific fin density and configuration designed for low-profile applications where vertical space is limited (only 10mm high). * **pushPIN™ Attachment:** Instead of messy adhesives, this part uses a spring-loaded pin mechanism. This provides: * **Consistent Pressure:** Ensures maximum contact between the heatsink and the chip. * **Reliability:** Resistant to vibration and thermal expansion. * **Pre-applied TIM:** Usually comes with a high-performance **Thermal Interface Material (TIM)** pre-applied to the base to bridge the microscopic air gaps between the heatsink and the electronic component. * **Compliance:** This part is **RoHS and REACH compliant**, meeting environmental safety standards for electronic manufacturing. --- ### 4. Typical Applications This component is used in environments where heat dissipation is critical for electronic stability: * **CPUs/GPUs:** Small form factor processors. * **ASICs and FPGAs:** High-speed logic chips that generate significant heat. * **Power Supplies:** Cooling power transistors and MOSFETs. * **Telecommunications:** Networking switches and routers.