The **ATS-14B-98-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Value / Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Series** | pushPIN™ Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | ~15.31°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 15mm | --- ### 2. Key Components & Design Features #### A. Fin Design (Cross-Cut) This model utilizes a **cross-cut fin pattern**. Unlike straight fins, cross-cut fins allow for multi-directional airflow. This is critical in cramped electronic enclosures where air may not be moving in a single, predictable path. #### B. The pushPIN™ Attachment System The "14B" in the part number signifies the specific attachment kit. It uses a spring-loaded push-pin mechanism which provides: * **Uniform Pressure:** Ensures the heat sink is pressed firmly against the component for optimal heat transfer. * **Reliability:** Resistant to vibration and mechanical shock. * **Ease of Assembly:** Can be installed manually or with basic tools into pre-drilled holes on the PCB. #### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with a pre-applied **Thermal Interface Material**. This fills the microscopic air gaps between the heat sink base and the electronic component to maximize thermal conductivity. --- ### 3. Applications The ATS-14B-98-C2-R0 is commonly used in the following electronic environments: 1. **Telecommunications:** Cooling line cards and routers. 2. **Embedded Systems:** For industrial PCs where space is limited. 3. **Power Supplies:** Cooling MOSFETs or voltage regulators. 4. **Automotive:** Managing heat in ADAS or infotainment control units. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 15.31 | | 200 (1.0 m/s) | 5.81 | | 400 (2.0 m/s) | 3.20 | | 600 (3.0 m/s) | 2.50 |