The **ATS-14D-01-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Thermal Resistance** | 21.92°C/W (Unducted @ 100 LFM) | | **Flow Direction** | Vertical / Omni-directional (Pin Fin) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Component Breakdown #### A. Fin Design (Pin Fin) Unlike standard extruded heat sinks with long continuous rails, this part uses a **Pin Fin** geometry. - **Benefit:** This allows for multidirectional airflow. If the fan direction changes or the air is turbulent, the pin fins still capture and dissipate heat effectively. - **Surface Area:** High density of pins increases the total surface area for heat exchange without significantly increasing the weight. #### B. pushPIN™ Attachment Mechanism The "R0" suffix refers to the attachment style. It uses a **pushPIN™** system which includes: - **Brass or Plastic Pins:** Designed to snap into pre-drilled holes in the PCB. - **Compression Springs:** These ensure a consistent, high-pressure contact between the heat sink and the electronic chip, which is critical for heat transfer. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. - **Purpose:** T766 is a high-performance thermal grease/paste that fills microscopic air gaps between the component surface and the heat sink base, drastically reducing thermal resistance. --- ### 3. Application Use Cases This specific heat sink is typically found in: * **Networking Hardware:** Routers, switches, and high-speed modems. * **Embedded Systems:** Industrial PC boards where space is restricted (low profile 10mm height). * **Power Supplies:** Cooling voltage regulators or power transistors. ---