The **ATS-14D-07-C2-R0** is a specific electronic component, categorized as a **High-Performance Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for thermal management in electronic assemblies. --- ## 1. Technical Specifications This component is engineered to dissipate heat from integrated circuits (ICs) and other electronic components. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-14D-07-C2-R0 | | **Heat Sink Type** | pushPIN™ | | **Fin Type** | Straight Fin (XC-Cut) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 17.00°C/W @ 100 LFM (Low Airflow) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.70mm | --- ## 2. Key Features ### A. pushPIN™ Attachment System The "R0" designation refers to the attachment mechanism. This system uses a spring-loaded push-pin which provides: * **Consistent Pressure:** Ensures optimal contact between the heat sink and the component. * **Secure Mounting:** Prevents the heat sink from shifting during vibration or shipping. * **Easy Installation:** Pre-drilled holes in the PCB allow for quick assembly without specialized tools. ### B. Material and Finish * **Aluminum Construction:** Offers a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Finish:** Increases surface area at a microscopic level and provides corrosion resistance while meeting industry aesthetic standards. ### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink comes pre-applied with **ATS-PPS-07** (or similar high-performance thermal grease). This ensures maximum heat transfer from the chip to the aluminum fins by filling microscopic air gaps. --- ## 3. Application Use Cases This specific heat sink is typically used for: 1. **Processors (CPUs/GPUs):** Small-scale embedded processors requiring passive or active cooling. 2. **FPGAs & ASICs:** High-density programmable logic devices that generate significant heat in localized areas. 3. **Telecommunications:** Network switches and routers where airflow is managed within a chassis. --- ## 4. Dimensional Diagram Below is a conceptual layout of the component dimensions: ```text 45.00 mm (Length) _______________________ | ||||||||| | | ||||||||| | 45.00 mm (Width) | ||||||||| | |_______|||||||||_______| [12.70 mm Height] ```