ATS-14D-08-C2-R0
AI

The **ATS-14D-08-C2-R0** is a specific high-performance electronic component belonging to the **Heat Sink** category, manufactured by *Advanced Thermal Solutions (ATS)*. It is part of the **pushPIN™** line designed for cooling Integrated Circuits (ICs) and other electronic surface-mount components.
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### 1. Technical Specifications
The following table highlights the critical mechanical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm |
| **Thermal Resistance** | 14.61°C/W (Unducted @ 100 LFM) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Interface Material** | T766 (Pre-applied) |
| **Hole Pattern** | Square |
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### 2. Design and Construction
The "08" series indicates a specific fin geometry and height. This part utilizes a **Fine Pitch** or **Cross-Cut** design to maximize surface area for heat dissipation.
* **Push-Pin Attachment:** Instead of messy adhesives, it uses a brass or plastic pin with a compressed spring. This ensures consistent pressure (clamping force) on the chip, improving thermal transfer.
* **The "C2" Rating:** This indicates that the heat sink is made from AL-6063 aluminum and features a specific thermal performance profile optimized for moderate airflow.
* **The "R0" Suffix:** This generally refers to the revision and RoHS (Restriction of Hazardous Substances) compliance of the part.
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### 3. Application in Electronics
This component is typically found in the following electronic environments:
1. **Networking Hardware:** Cooling CPUs or ASICs in routers and switches.
2. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high.
3. **Power Electronics:** Dissipating heat from high-speed transistors or voltage regulators.
### 4. Thermal Performance Comparison
Thermal resistance varies based on the airflow (LFM - Linear Feet per Minute):
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 14.61 |
| 300 | 1.5 | 3.66 |
| 500 | 2.5 | 2.06 |
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- ⤷What is the difference between T766 and other thermal interface materials?
- ⤷ Can this heat sink be mounted using adhesive tape instead of push-pins?
- ⤷ How do I calculate the required LFM for my specific processor?