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  • ATS-14D-08-C2-R0

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    The **ATS-14D-08-C2-R0** is a specific high-performance electronic component belonging to the **Heat Sink** category, manufactured by *Advanced Thermal Solutions (ATS)*. It is part of the **pushPIN™** line designed for cooling Integrated Circuits (ICs) and other electronic surface-mount components. --- ### 1. Technical Specifications The following table highlights the critical mechanical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Thermal Resistance** | 14.61°C/W (Unducted @ 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface Material** | T766 (Pre-applied) | | **Hole Pattern** | Square | --- ### 2. Design and Construction The "08" series indicates a specific fin geometry and height. This part utilizes a **Fine Pitch** or **Cross-Cut** design to maximize surface area for heat dissipation. * **Push-Pin Attachment:** Instead of messy adhesives, it uses a brass or plastic pin with a compressed spring. This ensures consistent pressure (clamping force) on the chip, improving thermal transfer. * **The "C2" Rating:** This indicates that the heat sink is made from AL-6063 aluminum and features a specific thermal performance profile optimized for moderate airflow. * **The "R0" Suffix:** This generally refers to the revision and RoHS (Restriction of Hazardous Substances) compliance of the part. --- ### 3. Application in Electronics This component is typically found in the following electronic environments: 1. **Networking Hardware:** Cooling CPUs or ASICs in routers and switches. 2. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. 3. **Power Electronics:** Dissipating heat from high-speed transistors or voltage regulators. ### 4. Thermal Performance Comparison Thermal resistance varies based on the airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 14.61 | | 300 | 1.5 | 3.66 | | 500 | 2.5 | 2.06 | ---
    ✨ Follow-up Questions
    • ⤷What is the difference between T766 and other thermal interface materials?
    • ⤷ Can this heat sink be mounted using adhesive tape instead of push-pins?
    • ⤷ How do I calculate the required LFM for my specific processor?