ATS-14D-101-C2-R0
AI

The **ATS-14D-101-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits.
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## Technical Specifications
The following table outlines the physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-14D-101-C2-R0 |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 30mm |
| **Thermal Resistance** | 6.69°C/W (at 200 LFM) |
| **Attachment Method** | pushPIN™ (Brass/Plastic pins) |
| **Interface Material** | T766 (Thermal Interface Material pre-applied) |
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## Key Design Components
### 1. maxiFLOW™ Fin Design
The "maxiFLOW" architecture features a tapered fin design. Unlike traditional square heat sinks, these fins are angled to maximize surface area and improve airflow efficiency. This reduces the "dead zone" of air directly behind the heat sink, allowing for better cooling in low-airflow environments.
### 2. pushPIN™ Attachment
This model uses the **pushPIN™** system, which consists of:
* **Spring-loaded pins:** Provide consistent pressure across the component for optimal thermal contact.
* **Standardized mounting:** Allows for easy installation without complex brackets.
* **Compression Springs:** Available in various tensions to prevent damage to sensitive PCB components.
### 3. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied to the base. This is a high-performance thermal grease that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance.
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## Performance Metrics
The thermal performance of the ATS-14D-101-C2-R0 is highly dependent on the air velocity (measured in Linear Feet per Minute - LFM):
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 | 6.69 |
| 300 | 4.81 |
| 400 | 3.89 |
| 500 | 3.34 |
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## Typical Applications
* **Networking Gear:** Switches and routers.
* **Embedded Systems:** Industrial PCs and automation controllers.
* **Consumer Electronics:** High-performance gaming consoles or media servers.
* **Power Supplies:** Cooling voltage regulators and power MOSFETs.
- ⤷
What are the specific hole patterns required on a PCB for the pushPIN™ attachment?
- ⤷ How does the Blue Anodized finish affect the thermal performance compared to bare aluminum?
- ⤷ Can this heat sink be used with custom thermal pads instead of the pre-applied T766?