The part number **ATS-14D-101-C3-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. This specific component belongs to the "maxiFLOW" product line, designed to optimize airflow and thermal dissipation for electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 6.77°C/W (Unducted Flow @ 200 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Flange Style** | 4-Corner / Square | --- ### 2. Design Characteristics The ATS-14D-101-C3-R0 is engineered with specific features to handle high thermal loads in constrained spaces: * **maxiFLOW™ Geometry:** The heatsink features a tapered fin design that increases surface area and improves airflow intake, which is critical for cooling high-density electronics. * **pushPIN™ Attachment:** It uses a specialized push-pin system with a compression spring. This ensures a consistent and secure pressure (Force) against the component, maximizing thermal interface material (TIM) performance. * **Material Efficiency:** Made from aluminum, it offers a balance between lightweight construction and high thermal conductivity. * **C3 Classification:** The "C3" suffix typically indicates the specific thermal interface material (TIM) or hardware configuration provided with the unit. --- ### 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **14D** | Series / Product Family | | **101** | Specific size/fin configuration | | **C3** | Specific hardware/TIM configuration | | **R0** | Revision code (Standard RoHS Compliant) | --- ### 4. Applications * **Network Switches:** Cooling high-speed processing chips. * **Power Supplies:** Dissipating heat from power MOSFETs or regulators. * **Embedded Systems:** Industrial PCs where vertical space is available but footprint is limited.