The part number **ATS-14D-124-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their *push-pin* attachment series designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Type** | Square Pin Fin | | **Thermal Resistance** | 3.18°C/W (at 200 LFM) | | **Dimensions** | 50mm x 50mm x 25mm | | **Weight** | ~48 grams | --- ### 2. Breakdown of the Part Number The nomenclature identifies specific features of the cooling solution: * **ATS**: The manufacturer (Advanced Thermal Solutions). * **14D**: Represents the specific series (SuperGrip/Push-Pin attachment). * **124**: Refers to the specific thermal and physical profile (size/fin density). * **C2**: Indicates the thermal interface material (TIM). In this case, it usually refers to **T766** (a high-performance thermal phase-change material). * **R0**: Refers to the RoHS compliance status and revision. --- ### 3. Key Electronic Functions While the heat sink itself is passive (no electricity flows through it), it serves a critical role in the reliability of electronic circuits: 1. **Heat Dissipation**: It increases the surface area of the heat-generating component, allowing air to carry away heat via convection more efficiently. 2. **Pin Fin Design**: The "Square Pin Fin" geometry is ideal for environments where the airflow direction is inconsistent or "omnidirectional," as air can enter the fin array from any side. 3. **Thermal Protection**: By maintaining a lower junction temperature, it prevents "Thermal Throttling" in processors and extends the lifespan of the semiconductor. --- ### 4. Installation and Attachment The **Push-Pin** system used in this model consists of: * **Spring-loaded pins**: These provide the necessary downward force (pressure) to ensure the thermal interface material (TIM) makes perfect contact between the chip and the heat sink. * **Pre-drilled Holes**: This heat sink requires the PCB to have specific mounting holes drilled around the electronic component to secure the pins.