The **ATS-14D-129-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its specifications and physical characteristics. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 8.68°C/W (Unducted Flow @ 100 LFM) | | **Pressure Drop** | High-efficiency fin design | --- ### 2. Physical Dimensions The part is designed for compact PCB layouts where vertical clearance and precise airflow are critical. | Dimension | Measurement | | :--- | :--- | | **Length/Width** | 54.00 mm x 54.00 mm | | **Height** | 10.00 mm (Low Profile) | | **Hole Spacing** | 47.00 mm | | **Weight** | ~45 grams | --- ### 3. Key Electronic/Thermal Features * **Fin Design (Cross-Cut):** The "129" series features a cross-cut fin pattern. This allows for multi-directional airflow, making it ideal for systems where the fan direction might change or where turbulence is high. * **Push-Pin Attachment:** Instead of messy adhesives or simple clips, this uses a spring-loaded brass push-pin. This ensures **consistent interface pressure** against the semiconductor (CPU/GPU/FPGA), which is vital for efficient heat transfer. * **Interface Material:** It typically comes with **T766** pre-applied thermal interface material (TIM), ensuring the microscopic gaps between the chip and the aluminum are filled for maximum conductivity. * **Thermal Performance:** * *Low Airflow:* 8.68°C/W * *High Airflow (700 LFM):* 1.59°C/W * This indicates the device is highly scalable based on the system's fan speed. --- ### 4. Typical Applications This specific part is commonly found cooling: 1. **High-speed Networking Chips** (Switches and Routers) 2. **Field Programmable Gate Arrays (FPGAs)** 3. **Embedded Computing Modules** 4. **Power Supplies** that require low-profile cooling solutions.