The **ATS-14D-13-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" product line, which is engineered to maximize surface area and optimize airflow for cooling high-heat electronic components. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Fin Type** | High Performance maxiFLOW™ | | **Dimensions** | 50mm x 50mm x 15mm | | **Mounting Style** | pushPIN™ (Brass Pins) | | **Thermal Resistance** | 1.37°C/W (at 200 LFM) | | **Attachment** | Spring-loaded push pins | | **Interface Material** | T766 (Thermal Interface Material) | --- ## 2. Key Design Features ### A. Fin Geometry (maxiFLOW™) The "maxiFLOW" design utilizes a unique flared fin structure. Unlike standard straight-fin heatsinks, these fins increase the surface area while reducing pressure drop. This allows more air to pass through the fins, significantly improving cooling efficiency in systems with forced-air cooling. ### B. pushPIN™ Attachment This model uses a **pushPIN™** system, which is a standardized mounting mechanism. * **Ease of Use:** Allows for rapid assembly to the PCB. * **Reliability:** The brass pins and springs provide a consistent pressure (compression) on the thermal interface material (TIM), ensuring optimal heat transfer between the chip and the heatsink. ### C. Thermal Interface Material (T766) The part comes pre-applied with **T766**. This is a high-performance thermal grease or pad that fills microscopic air gaps between the heatsink base and the electronic component (CPU, GPU, or ASIC), lowering the thermal resistance of the assembly. --- ## 3. Applications The ATS-14D-13-C2-R0 is typically used in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** For industrial computers where space is limited but heat density is high. 3. **Power Supplies:** Heat dissipation for MOSFETs and power regulators. ---