The **ATS-14D-166-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent thermal throttling or component failure. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 12.30°C/W (Unducted Flow @ 100 LFM) | | **Thermal Resistance** | 2.00°C/W (Ducted Flow @ 700 LFM) | | **Dimensions** | 25mm x 25mm x 15mm | --- ### 2. Physical Design and Construction * **Fins:** It features a **Straight Fin** pattern. This design is optimized for airflow directed across the length of the fins, providing a high surface area-to-volume ratio. * **Material:** Constructed from high-quality aluminum for optimal thermal conductivity while remaining lightweight. * **Thermal Interface Material (TIM):** This specific model typically comes with **T412** pre-applied. T412 is a high-performance phase-change material that ensures minimal air gaps between the heat sink and the electronic component (CPU/GPU/FPGA). --- ### 3. Attachment Mechanism: pushPIN™ The part number suffix "R0" refers to the specific attachment kit included. The **pushPIN™** system consists of: 1. **Brass or Plastic Pins:** Designed to fit into pre-drilled holes on the PCB. 2. **Compression Springs:** These provide precise, uniform pressure (load) on the component to maximize heat transfer. 3. **Stability:** This mechanical attachment is more secure than thermal adhesive tapes and allows for easy removal and re-application. --- ### 4. Application and Usage This part is commonly found in the following electronic environments: * **Embedded Systems:** Cooling small form-factor processors. * **Telecommunications:** Cooling ASICs and chipsets in network switches. * **Power Electronics:** Managing heat for voltage regulators or power converters. ---