The **ATS-14D-178-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Base Dimensions** | 35mm x 35mm | | **Height** | 25mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.10°C/W (at 200 LFM) | | **Fin Pattern** | Straight Fin | --- ## 2. Component Breakdown ### A. Material and Coating * **Aluminum 6063:** This alloy is chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** The anodization provides corrosion resistance and increased surface emissivity, which helps slightly in radiant heat dissipation. ### B. The pushPIN™ Attachment System One of the core features of this part is the **pushPIN™** system. Unlike adhesive-based heat sinks, this uses: * **Compression Springs:** These ensure constant, uniform pressure across the component surface for maximum thermal transfer. * **Plastic/Brass Pins:** These lock into pre-drilled holes on the Printed Circuit Board (PCB), ensuring the heat sink remains stable under vibration or mechanical shock. ### C. Thermal Performance (Flow Rate) The efficiency of this heat sink depends on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 3.82 | | **200 (1.0 m/s)** | 2.10 | | **400 (2.0 m/s)** | 1.61 | | **600 (3.0 m/s)** | 1.39 | --- ## 3. Part Number Decoder The part number **ATS-14D-178-C2-R0** can be broken down to understand its configuration: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **14:** Series/Attachment type. * **D:** Attachment size/Spring tension variant. * **178:** Specific dimension/fin geometry profile. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or packaging code. --- ### Summary for Integration When integrating the ATS-14D-178-C2-R0, ensure your PCB layout includes the necessary **hole patterns** for the pushPIN system. It is highly recommended to use a **Thermal Interface Material (TIM)**, such as thermal grease or a pad, between the component and the heat sink base to eliminate air gaps.