The **ATS-14D-23-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Fin Type** | Cross-Cut (Increases airflow efficiency) | | **Attachment Method** | Push-Pin (Plastic) with Brass Springs | | **Thermal Resistance** | 12.01°C/W (at 1.0 m/s airflow) | | **Dimensions (L x W)** | 60mm x 60mm | | **Height** | 15mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied phase change material) | --- ### 2. Breakdown of Electronic Utility #### A. Thermal Management As an electronic part, its primary role is **passive cooling**. By increasing the surface area of a heat-generating component, it transfers thermal energy to the surrounding air via convection. The "Cross-Cut" fin design is particularly effective because it allows for multi-directional airflow, making it suitable for systems where the airflow direction might be unpredictable. #### B. Attachment Mechanism The "R0" designation refers to the attachment kit. This model uses **Plastic Push-Pins**. * **Purpose:** Provides consistent pressure (clamping force) on the electronic chip to ensure the Thermal Interface Material (TIM) fills all microscopic gaps. * **Safety:** The brass springs ensure that even if the board vibrates or experiences thermal expansion, the heat sink remains securely seated without cracking the silicon die. #### C. Thermal Interface Material (T766) This heat sink comes with **T766** pre-applied. In the electronics industry, this is a "Phase Change Material." When the electronic component reaches a certain temperature, the TIM softens to a liquid-like state, ensuring maximum contact between the chip and the aluminum base. --- ### 3. Common Applications * **Networking Equipment:** High-speed routers and switches. * **Industrial PCs:** Cooling processors in fanless or high-airflow environments. * **Embedded Systems:** Protecting SoCs (System on Chips) from thermal throttling.