The **ATS-14D-24-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **Heat Sink** designed for cooling electronic components such as CPUs, GPUs, or power transistors. ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Series** | pushPIN™ HS | | **Heat Sink Type** | Push-Pin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance (Unducted)** | 5.88 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.33 °C/W @ 100 LFM | | **Base Dimensions** | 60.00mm x 60.00mm | | **Height (Off Base)** | 20.00mm | --- ### 2. Key Design Elements #### A. pushPIN™ Attachment System This component features a specialized mounting mechanism. Unlike adhesive-based heat sinks, the push-pin system uses a pre-assembled brass component with a stainless steel spring. * **Benefits:** Ensures consistent pressure on the component (TIM - Thermal Interface Material), which optimizes heat transfer. * **Reliability:** Resistant to vibration and mechanical shock compared to thermal tape. #### B. Fin Profile (Straight Fin) The **ATS-14D-24-C2-R0** utilizes a straight-fin design. This is ideal for applications with high-velocity airflow (active cooling). The gaps between the fins allow air to pass through and carry away heat efficiently. #### C. Thermal Interface Material (TIM) * **Pre-Applied:** This model typically comes with **T412** thermal tape or a phase-change material applied to the base. * **Purpose:** Fills microscopic air gaps between the heat sink and the electronic chip to minimize thermal resistance. --- ### 3. Dimensional Drawing Reference | Dimension | Metric Value | | :--- | :--- | | **Length (A)** | 60.00 mm | | **Width (B)** | 60.00 mm | | **Height (C)** | 20.00 mm | | **Pitch (E)** | 53.00 mm | | **Pitch (F)** | 53.00 mm | --- ### 4. Applications This specific size and thermal rating are commonly used in: 1. **Networking Hardware:** Switches and Routers. 2. **Industrial PCs:** Embedded systems requiring passive or active cooling. 3. **Power Supplies:** Cooling MOSFETs or Voltage Regulators.