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  • ATS-14D-27-C2-R0

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    The **ATS-14D-27-C2-R0** is a high-performance electronic component specifically designed for thermal management. It is a **Heatsink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)* as part of their **pushPIN™** series. Below is a detailed breakdown of its specifications and electronic application. --- ### 1. Technical Specifications This heatsink is designed for localized cooling of surface-mount components like BGA (Ball Grid Array) chips, CPUs, or GPUs. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-14D-27-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) | | **Dimensions (L x W x H)** | 70mm x 70mm x 12.7mm | | **Thermal Resistance** | 12.24°C/W (Unducted Flow @ 100 LFM) | | **Fin Pattern** | Straight Fin | --- ### 2. Physical Design & Cooling Mechanism The "C2" in the part number indicates the material and thermal interface material (TIM) grade. * **Heat Dissipation:** It uses a high-density straight-fin design to maximize surface area contact with moving air (convection). * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is a phase-change material or thermal pad that fills microscopic air gaps between the heat source and the aluminum base to improve heat transfer. * **Form Factor:** At only 12.7mm high, it is considered a "Low Profile" heatsink, making it ideal for 1U servers or compact electronic enclosures where vertical space is limited. --- ### 3. Mounting System (pushPIN™) The electronic assembly process is simplified by the mounting hardware: * **Compression Springs:** The unit uses a brass or plastic push-pin with a stainless steel spring. This ensures even pressure across the electronic chip, preventing "hot spots" or physical damage to the silicon die. * **Hole Pattern:** It requires specific pre-drilled holes in the PCB (Printed Circuit Board). The pitch (distance between holes) for this 70mm model is typically **63mm**. --- ### 4. Typical Applications This part is commonly found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial motherboards. 3. **Power Electronics:** Cooling MOSFET arrays or large voltage regulators.
    ✨ Follow-up Questions
    • ⤷ What is the significance of the 'Blue Anodized' finish on this heatsink?
    • ⤷ How do I calculate if the 12.24°C/W thermal resistance is sufficient for my chip?
    • ⤷ Are there different spring tensions available for the pushPIN system?