ATS-14D-27-C2-R0
AI

The **ATS-14D-27-C2-R0** is a high-performance electronic component specifically designed for thermal management. It is a **Heatsink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)* as part of their **pushPIN™** series.
Below is a detailed breakdown of its specifications and electronic application.
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### 1. Technical Specifications
This heatsink is designed for localized cooling of surface-mount components like BGA (Ball Grid Array) chips, CPUs, or GPUs.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Part Number** | ATS-14D-27-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) |
| **Dimensions (L x W x H)** | 70mm x 70mm x 12.7mm |
| **Thermal Resistance** | 12.24°C/W (Unducted Flow @ 100 LFM) |
| **Fin Pattern** | Straight Fin |
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### 2. Physical Design & Cooling Mechanism
The "C2" in the part number indicates the material and thermal interface material (TIM) grade.
* **Heat Dissipation:** It uses a high-density straight-fin design to maximize surface area contact with moving air (convection).
* **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is a phase-change material or thermal pad that fills microscopic air gaps between the heat source and the aluminum base to improve heat transfer.
* **Form Factor:** At only 12.7mm high, it is considered a "Low Profile" heatsink, making it ideal for 1U servers or compact electronic enclosures where vertical space is limited.
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### 3. Mounting System (pushPIN™)
The electronic assembly process is simplified by the mounting hardware:
* **Compression Springs:** The unit uses a brass or plastic push-pin with a stainless steel spring. This ensures even pressure across the electronic chip, preventing "hot spots" or physical damage to the silicon die.
* **Hole Pattern:** It requires specific pre-drilled holes in the PCB (Printed Circuit Board). The pitch (distance between holes) for this 70mm model is typically **63mm**.
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### 4. Typical Applications
This part is commonly found in:
1. **Telecommunications:** High-speed routers and switches.
2. **Embedded Systems:** Industrial motherboards.
3. **Power Electronics:** Cooling MOSFET arrays or large voltage regulators.
- ⤷
What is the significance of the 'Blue Anodized' finish on this heatsink?
- ⤷ How do I calculate if the 12.24°C/W thermal resistance is sufficient for my chip?
- ⤷ Are there different spring tensions available for the pushPIN system?