ATS-14D-29-C2-R0
AI

The **ATS-14D-29-C2-R0** is a specific electronic cooling component manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series of high-performance heat sinks.
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## 1. Technical Specifications
Below are the primary physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Component Type** | Heat Sink |
| **Attachment Method** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 20.00mm |
| **Thermal Resistance (Flowing)** | 7.57 °C/W @ 100 LFM |
| **Thermal Resistance (Static)** | 0.53 °C/W (at high velocity) |
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## 2. Key Features and Design
### A. pushPIN™ Attachment
This part utilizes a specialized mechanical attachment system called **pushPIN™**.
* **Ease of Assembly:** Allows for quick installation onto the PCB.
* **Compression Springs:** Features a pre-assembled brass component with a stainless steel spring to ensure consistent pressure (load) on the electronic component (CPU, FPGA, or GPU), optimizing heat transfer.
### B. maxiFLOW™ Fin Geometry
The fin design is not a standard straight-fin layout. It uses a **tapered fin** profile.
* **Increased Surface Area:** The design maximizes the surface area for radiant cooling.
* **Airflow Efficiency:** It is engineered to reduce pressure drop while maximizing the volume of air passing through the fins.
### C. Thermal Interface Material (TIM)
The "R0" suffix typically indicates the type of Thermal Interface Material pre-applied to the base.
* **T412:** This specific model usually comes with **T412** phase-change material or a high-performance thermal pad, ensuring no air gaps exist between the heat source and the aluminum base.
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## 3. Applications
This electronic part is commonly used in high-heat density environments, including:
1. **Telecommunications:** High-speed routers and switches.
2. **Computing:** Server CPUs and localized power components.
3. **Industrial:** Power supplies and motor controllers where vertical space (20mm) is available.
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- ⤷
What is the difference between blue anodized and black anodized finishes for heat sinks?
- ⤷ How do I calculate if the 7.57 °C/W thermal resistance is sufficient for my chip?
- ⤷ Are there alternative mounting methods if my PCB doesn't support pushPIN?