Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-14D-29-C2-R0

  • AI
    The **ATS-14D-29-C2-R0** is a specific electronic cooling component manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series of high-performance heat sinks. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 20.00mm | | **Thermal Resistance (Flowing)** | 7.57 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 0.53 °C/W (at high velocity) | --- ## 2. Key Features and Design ### A. pushPIN™ Attachment This part utilizes a specialized mechanical attachment system called **pushPIN™**. * **Ease of Assembly:** Allows for quick installation onto the PCB. * **Compression Springs:** Features a pre-assembled brass component with a stainless steel spring to ensure consistent pressure (load) on the electronic component (CPU, FPGA, or GPU), optimizing heat transfer. ### B. maxiFLOW™ Fin Geometry The fin design is not a standard straight-fin layout. It uses a **tapered fin** profile. * **Increased Surface Area:** The design maximizes the surface area for radiant cooling. * **Airflow Efficiency:** It is engineered to reduce pressure drop while maximizing the volume of air passing through the fins. ### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates the type of Thermal Interface Material pre-applied to the base. * **T412:** This specific model usually comes with **T412** phase-change material or a high-performance thermal pad, ensuring no air gaps exist between the heat source and the aluminum base. --- ## 3. Applications This electronic part is commonly used in high-heat density environments, including: 1. **Telecommunications:** High-speed routers and switches. 2. **Computing:** Server CPUs and localized power components. 3. **Industrial:** Power supplies and motor controllers where vertical space (20mm) is available. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between blue anodized and black anodized finishes for heat sinks?
    • ⤷ How do I calculate if the 7.57 °C/W thermal resistance is sufficient for my chip?
    • ⤷ Are there alternative mounting methods if my PCB doesn't support pushPIN?