The **ATS-14D-33-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is a high-performance **heat sink** designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. General Specifications This part belongs to the **maxiFLOW™** series, which is known for its high-aspect-ratio fin design to maximize surface area for heat dissipation. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-14D-33-C2-R0 | | **Type** | Heat Sink | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the part fits within the PCB layout and clears neighboring components. | Dimension | Measurement | | :--- | :--- | | **Length (Side A)** | 36.83 mm | | **Width (Side B)** | 36.83 mm | | **Height (Side C)** | 17.78 mm | | **Hole Spacing (Side E)** | 42.72 mm | | **Hole Spacing (Side F)** | 42.72 mm | --- ### 3. Thermal Performance Thermal resistance determines how effectively the part moves heat away from the silicon die. Lower numbers indicate better cooling performance. * **Thermal Resistance (Unducted Flow):** 17.42 °C/W @ 100 LFM * **Thermal Resistance (Ducted Flow):** 2.85 °C/W @ 200 LFM * **Performance Note:** The effectiveness increases significantly as airflow (measured in Linear Feet per Minute - LFM) increases. --- ### 4. Key Component Features #### **A. pushPIN™ Attachment System** Unlike adhesive tapes or simple clips, the **pushPIN™** system uses a flexible, spring-loaded mechanism. This ensures: * **Uniform Pressure:** Maintains consistent contact between the heat sink and the component for optimal thermal transfer. * **Secure Mounting:** Highly resistant to shock and vibration. * **Easy Installation:** Pre-drilled holes in the PCB allow for quick assembly. #### **B. Material and Thermal Interface** * **Aluminum Body:** Provides a balance between light weight and high thermal conductivity. * **Blue Anodized Finish:** Protects the aluminum from corrosion and slightly improves radiant heat transfer. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal grease/pad that fills microscopic gaps between the chip and the heat sink. --- ### 5. Application Use Cases This component is commonly used in: 1. **Telecommunications:** Cooling processors in switches and routers. 2. **Embedded Systems:** Cooling SoCs (System on Chips) in industrial computers. 3. **Power Electronics:** Dissipating heat from high-speed transistors or voltage regulators.