The **ATS-14D-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from integrated circuits like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-14D-35-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 12.83°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 10.00mm | | **Fin Style** | Fine Pitch (maxiFLOW) | --- ### 2. Breakdown of the Part Number Understanding the nomenclature helps identify the specific configuration of the electronic part: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **14**: Heat Sink Series. * **D**: Fin configuration/density type. * **35**: Component length (approx. 35-37mm). * **C2**: Material and Finish (Aluminum with a Blue Anodized finish). * **R0**: Revision or specific packaging code. --- ### 3. Key Electronic/Mechanical Features #### A. Thermal Performance This part is engineered for **forced air environments**. The maxiFLOW™ design features a spread-fin geometry which maximizes the surface area for cooling while reducing the pressure drop across the heat sink. This is critical for maintaining stable operating temperatures in high-density PCBs. #### B. pushPIN™ Attachment Instead of using messy thermal adhesives that are permanent, this part uses a **pushPIN™** system. * It utilizes a brass or plastic pin with a compression spring. * This ensures a precise, consistent "pull" or pressure against the electronic component, optimizing the thermal interface. #### C. Thermal Interface Material (TIM) The "C2" designation usually implies that the heat sink comes with a **pre-applied Thermal Interface Material** (typically a high-performance phase-change material or thermal pad) to ensure there are no air gaps between the semiconductor and the aluminum. --- ### 4. Typical Applications * **Telecommunications:** Cooling of high-speed network processors. * **Embedded Systems:** Industrial PCs where space is limited but heat density is high. * **Power Supplies:** Regulating the temperature of MOSFETs or voltage regulators.