ATS-14D-36-C2-R0
AI

The **ATS-14D-36-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "maxiFLOW" series, designed to dissipate heat from high-power electronic components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Anodized Blue) |
| **Dimensions** | 36.83mm x 36.83mm |
| **Height** | 12.70mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 14.81°C/W (at 100 LFM) |
| **Airflow Path** | MaxiFLOW (Spread fin pattern) |
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### 2. Core Electronic Functions
While the heat sink itself does not process signals, it is a critical "passive" component for the reliability of an electronic system:
* **Thermal Dissipation:** It increases the surface area of the heat-generating semiconductor, allowing for efficient transfer of heat into the ambient air.
* **Performance Maintenance:** By keeping a processor below its T-junction (maximum operating temperature), it prevents **thermal throttling**, where the chip slows down its clock speed to cool itself.
* **Mechanical Protection:** The `pushPIN™` attachment system ensures a precise and consistent pressure (clamping force) on the electronic chip, which optimizes the interface between the chip and the thermal interface material (TIM).
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### 3. Part Number Breakdown
The nomenclature for this part provides specific details about its configuration:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Manufacturer) |
| **14D** | Series/Product Family (maxiFLOW) |
| **36** | Size/Width (approx. 36mm) |
| **C2** | Thermal Performance Grade / Material finish |
| **R0** | Revision or Packaging code |
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### 4. Installation and Compatibility
This part is designed for **PCB (Printed Circuit Board)** mounting. It requires pre-drilled holes in the PCB to accommodate the pushPIN™ connectors. It is typically used in:
* Networking hardware (switches/routers).
* Embedded computing modules.
* Industrial power supplies.
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What are the compatible thermal interface materials for this heat sink?
- ⤷ How do I calculate the airflow required for this specific thermal resistance?
- ⤷ Does this model come in different height configurations?