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  • ATS-14D-36-C2-R0

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    The **ATS-14D-36-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "maxiFLOW" series, designed to dissipate heat from high-power electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Dimensions** | 36.83mm x 36.83mm | | **Height** | 12.70mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 14.81°C/W (at 100 LFM) | | **Airflow Path** | MaxiFLOW (Spread fin pattern) | --- ### 2. Core Electronic Functions While the heat sink itself does not process signals, it is a critical "passive" component for the reliability of an electronic system: * **Thermal Dissipation:** It increases the surface area of the heat-generating semiconductor, allowing for efficient transfer of heat into the ambient air. * **Performance Maintenance:** By keeping a processor below its T-junction (maximum operating temperature), it prevents **thermal throttling**, where the chip slows down its clock speed to cool itself. * **Mechanical Protection:** The `pushPIN™` attachment system ensures a precise and consistent pressure (clamping force) on the electronic chip, which optimizes the interface between the chip and the thermal interface material (TIM). --- ### 3. Part Number Breakdown The nomenclature for this part provides specific details about its configuration: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **14D** | Series/Product Family (maxiFLOW) | | **36** | Size/Width (approx. 36mm) | | **C2** | Thermal Performance Grade / Material finish | | **R0** | Revision or Packaging code | --- ### 4. Installation and Compatibility This part is designed for **PCB (Printed Circuit Board)** mounting. It requires pre-drilled holes in the PCB to accommodate the pushPIN™ connectors. It is typically used in: * Networking hardware (switches/routers). * Embedded computing modules. * Industrial power supplies.
    ✨ Follow-up Questions
    • ⤷ What are the compatible thermal interface materials for this heat sink?
    • ⤷ How do I calculate the airflow required for this specific thermal resistance?
    • ⤷ Does this model come in different height configurations?