The **ATS-14D-38-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from surface-mount components like BGA (Ball Grid Array) packages. --- ## 1. Technical Specifications Below is a breakdown of the physical and thermal characteristics of the part: | Attribute | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Passive Cooling) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.42°C/W @ 100 LFM (unductecl) | | **Flow Pattern** | maxiFLOW™ (Distributed Fin Design) | | **Overall Dimensions** | 36.83mm x 41.50mm | | **Height (Profile)** | 22.86mm | --- ## 2. Key Electronic & Mechanical Parts The assembly consists of three primary sub-components that work together to protect the electronic IC (Integrated Circuit): ### A. The Heat Sink Body (maxiFLOW™) The body is constructed from high-grade aluminum. The **maxiFLOW™** design features a flared fin structure. * **Purpose:** Increases surface area while reducing pressure drop. * **Electronic Impact:** It draws heat away from the silicon die of the IC to prevent thermal throttling or permanent damage. ### B. The pushPIN™ Attachment This part replaces traditional adhesive tapes or fragile clips. * **Components:** Steel springs and plastic/brass pins. * **Purpose:** It provides a specific **Pre-load** (pressure) between the heat sink and the chip. * **Electronic Impact:** Uniform pressure ensures that the Thermal Interface Material (TIM) fills all microscopic gaps, minimizing thermal resistance. ### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the specific TIM used. * **Material:** Typically **T766** (a high-performance thermal grease/pad). * **Purpose:** Conducts heat from the top of the electronic package into the aluminum base. --- ## 3. Application Use Cases This specific part is used in environments where electronic components are packed densely and require reliable airflow cooling: 1. **Telecommunications:** Cooling network processors and ASICs. 2. **Embedded Systems:** High-speed microcontrollers that generate significant heat. 3. **Power Electronics:** Dissipating heat from MOSFET arrays or power modules. --- ## 4. Performance at Different Airflows Thermal performance varies based on the Linear Feet per Minute (LFM) of airflow provided by system fans: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 6.42 | | 300 | 1.5 | 2.86 | | 500 | 2.5 | 2.10 |