The **ATS-14D-40-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized Finish) | | **Attachment Method** | Push-Pin (Brass/Plastic) | | **Thermal Resistance** | 14.56°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height** | 15.00mm | | **Fin Style** | Fine-Pitch (Cross-Cut) | --- ### 2. Part Number Breakdown (Nomenclature) Understanding the code **ATS-14D-40-C2-R0** helps identify its specific properties: * **ATS**: Prefix for Advanced Thermal Solutions. * **14**: Unique sequence/series identifier. * **D**: Indicates a specific push-pin or spring type (typically determines the attachment force). * **40**: Indicates the footprint size (45mm in this specific series configuration). * **C2**: Refers to the **Thermal Interface Material (TIM)**; C2 usually denotes **T766** (a high-performance thermal grease). * **R0**: Revision code. --- ### 3. Key Electronic Components & Features #### A. Push-Pin Mounting System Instead of using messy adhesives or permanent solder, this part uses a **spring-loaded push-pin** mechanism. * **Benefit:** Provides consistent pressure (Pre-assembled) across the chip surface to ensure maximum heat transfer. * **Maintenance:** Allows for easy removal and re-installation during PCB repairs. #### B. Fin Design (Cross-Cut) The heat sink features a **straight fin/cross-cut** pattern. * This design is optimized for **omni-directional airflow**, meaning the air can enter the fins from any direction, making it ideal for crowded PCB environments where airflow direction is unpredictable. #### C. Thermal Interface Material (TIM) The "C2" designation means the bottom of the heat sink comes pre-applied with a thermal compound. * **Function:** Fills microscopic air gaps between the chip die and the aluminum base to reduce thermal resistance. --- ### 4. Implementation Example In a circuit design, this component would be mapped in the mechanical layer of the PCB: ```markdown # PCB Design Integration - Hole Diameter: 3.175mm (Typical for ATS Push-Pins) - Hole Pitch: 38.00mm (Distance between mounting holes) - Keep-out Zone: 47mm x 47mm (To avoid component collision) ```