ATS-14D-41-C2-R0
AI

## Technical Specifications for ATS-14D-41-C2-R0
The **ATS-14D-41-C2-R0** is a high-performance heat sink designed by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series, specifically engineered for cooling electronic components like CPUs, GPUs, or high-speed chipsets on a Printed Circuit Board (PCB).
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### 1. Key Physical Specifications
The design follows a "cross-cut" pattern which allows for omnidirectional airflow, making it versatile for various chassis layouts.
| Parameter | Value / Detail |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (with Blue Anodized finish) |
| **Dimensions** | 40mm x 40mm x 25mm |
| **Attachment Type** | Push-Pin (Plastic or Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Interface Material** | T766 (Pre-applied phase change material) |
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### 2. Thermal Performance
Thermal resistance determines how effectively the heat sink transfers heat away from the component into the surrounding air.
* **Thermal Resistance (Low Airflow):** 10.02 °C/W @ 200 LFM
* **Thermal Resistance (High Airflow):** 2.26 °C/W @ 800 LFM
* **Fin Style:** Square Fins (Cross-cut)
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### 3. Electronic Design Considerations
When integrating this part into an electronic assembly, several electrical and mechanical factors must be considered:
#### Mechanical Clearances
The 25mm height is a "Medium Profile" design. Engineers must ensure there is no vertical interference with daughterboards or casing covers.
#### Attachment Mechanism
The push-pin system requires specific hole diameters and spacing on the PCB:
* **Hole Pattern:** Standardized for 40mm x 40mm sinks.
* **Pitch:** Specific to the ATS push-pin standard (usually around 43mm - 45mm diagonal).
#### Thermal Interface Material (TIM)
The `C2` designation typically refers to the use of **T766** thermal material. This is a high-performance material that fills microscopic air gaps between the component die and the aluminum base to maximize heat transfer.
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### 4. Part Number Breakdown
```text
ATS - 14 - D - 41 - C2 - R0
| | | | | |
| | | | | +-- Revision Code
| | | | +------- Thermal Interface Material (T766)
| | | +------------ Fin Configuration / Height (25mm)
| | +---------------- Attachment Style (Push-Pin)
| +--------------------- Series / Base Size (40mm)
+-------------------------- Manufacturer (Advanced Thermal Solutions)
```
- ⤷
What is the difference between T766 and other thermal interface materials used in ATS heat sinks?
- ⤷ How do I calculate the required airflow (LFM) for this specific heat sink in my project?
- ⤷ Does this model support custom mounting for non-standard PCB hole patterns?