Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-14D-41-C2-R0

  • AI
    ## Technical Specifications for ATS-14D-41-C2-R0 The **ATS-14D-41-C2-R0** is a high-performance heat sink designed by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series, specifically engineered for cooling electronic components like CPUs, GPUs, or high-speed chipsets on a Printed Circuit Board (PCB). --- ### 1. Key Physical Specifications The design follows a "cross-cut" pattern which allows for omnidirectional airflow, making it versatile for various chassis layouts. | Parameter | Value / Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (with Blue Anodized finish) | | **Dimensions** | 40mm x 40mm x 25mm | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material** | T766 (Pre-applied phase change material) | --- ### 2. Thermal Performance Thermal resistance determines how effectively the heat sink transfers heat away from the component into the surrounding air. * **Thermal Resistance (Low Airflow):** 10.02 °C/W @ 200 LFM * **Thermal Resistance (High Airflow):** 2.26 °C/W @ 800 LFM * **Fin Style:** Square Fins (Cross-cut) --- ### 3. Electronic Design Considerations When integrating this part into an electronic assembly, several electrical and mechanical factors must be considered: #### Mechanical Clearances The 25mm height is a "Medium Profile" design. Engineers must ensure there is no vertical interference with daughterboards or casing covers. #### Attachment Mechanism The push-pin system requires specific hole diameters and spacing on the PCB: * **Hole Pattern:** Standardized for 40mm x 40mm sinks. * **Pitch:** Specific to the ATS push-pin standard (usually around 43mm - 45mm diagonal). #### Thermal Interface Material (TIM) The `C2` designation typically refers to the use of **T766** thermal material. This is a high-performance material that fills microscopic air gaps between the component die and the aluminum base to maximize heat transfer. --- ### 4. Part Number Breakdown ```text ATS - 14 - D - 41 - C2 - R0 | | | | | | | | | | | +-- Revision Code | | | | +------- Thermal Interface Material (T766) | | | +------------ Fin Configuration / Height (25mm) | | +---------------- Attachment Style (Push-Pin) | +--------------------- Series / Base Size (40mm) +-------------------------- Manufacturer (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • ⤷ What is the difference between T766 and other thermal interface materials used in ATS heat sinks?
    • ⤷ How do I calculate the required airflow (LFM) for this specific heat sink in my project?
    • ⤷ Does this model support custom mounting for non-standard PCB hole patterns?