The **ATS-14D-47-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for high-efficiency cooling of surface-mount components like BGA (Ball Grid Array) chips. --- ### ## Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-14D-47-C2-R0 | | **Heat Sink Type** | Push-Pin (High Performance) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 6.58°C/W (at 1.0 m/s airflow) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | --- ### ## Core Electronic & Mechanical Features #### 1. Pin Fin Design Unlike traditional straight-fin heat sinks, this model utilizes a **straight-fin array** optimized for specific airflow directions. This increases the surface area exposed to moving air, facilitating faster heat dissipation from the semiconductor to the environment. #### 2. Attachment System (Push-Pin) This part uses a mechanical push-pin assembly. * **Reliability:** Provides consistent pressure on the processor, ensuring a high-quality interface with the Thermal Interface Material (TIM). * **Hardware:** It features pre-drilled holes for brass push-pins and springs that provide the necessary force to keep the heat sink seated during vibration or thermal cycling. #### 3. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates the inclusion of a specific TIM. * **Pre-applied:** Usually comes with a high-performance thermal pad or phase-change material on the base. * **Purpose:** Fills microscopic air gaps between the chip and the heat sink base to lower contact resistance. #### 4. Material Advantage The **Aluminum** construction offers a balance between lightweight design and high thermal conductivity, while the **Blue Anodized** finish protects the aluminum from corrosion and slightly improves radiant heat emissivity. --- ### ## Application Use Cases This component is generally found in: * **Networking Equipment:** Routers, switches, and gateways. * **Industrial PCs:** Cooling embedded processors. * **Power Supplies:** Heat dissipation for MOSFETs or high-speed regulators. * **Telecommunications:** Base stations and data transmission hardware.