## Electronic Parts Overview: ATS-14D-49-C2-R0 The **ATS-14D-49-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" heat sink series, designed primarily for thermal management of ICs (Integrated Circuits) like BGA (Ball Grid Array) packages. ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Thermal Resistance** | 5.41 °C/W (@ 100 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 20mm | | **Fin Pattern** | Square Pin Fin | | **Thermal Interface (TIM)** | T766 (Pre-applied Phase Change Material) | --- ### 2. Key Components & Materials * **Heat Sink Body:** Constructed from high-quality aluminum. The **Square Pin Fin** design is optimized for omni-directional airflow, meaning it performs well regardless of which direction the cooling air is blowing. * **Push Pin Assembly:** The "14D" in the part number indicates a specific push-pin and spring combination. These are made of **Brass** with a stainless steel spring to provide consistent pressure (load) on the processor, ensuring maximum heat transfer. * **Thermal Interface Material (TIM):** The "C2" suffix indicates it comes with **T766** pre-applied. This is a phase-change material that melts at operating temperatures to fill microscopic air gaps between the heat sink and the chip. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **14D** | Attachment Kit (Specific Push Pin size/material) | | **49** | Heat Sink dimensions and fin profile | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliance status / Revision | --- ### 4. Application Use Cases This part is commonly found in high-performance electronics where space is limited but heat dissipation is critical: * **Telecommunications:** Network switches and routers. * **Computing:** Embedded systems and industrial PC processors. * **Power Electronics:** Dissipating heat from high-speed FPGA or ASIC chips.