The **ATS-14D-52-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "push pin" series, intended for cooling components like CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications The model number encodes specific physical and thermal characteristics: | Property | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push Pin (with Springs) | | **Thermal Resistance** | 10.79°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (LxWxH)** | 30.00mm x 30.00mm x 25.00mm | | **Fin Type** | Square Pin Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features and Components #### A. Pin Fin Design Unlike traditional straight-fin heatsinks, this model uses a **Square Pin Fin** pattern. This design allows for: - **Omnidirectional Airflow:** It can receive cooling air from any direction, making it ideal for systems with complex internal turbulence. - **Higher Surface Area:** The pin structure increases the surface-to-volume ratio compared to standard extruded fins. #### B. Push Pin Attachment The mounting mechanism consists of two plastic or brass pins with internal springs. - **Consistency:** Provides precise, repeatable downward pressure on the electronic component. - **Security:** Prevents the heatsink from shifting during transport or vibration. - **Hole Spacing:** Designed for specific PCB hole patterns (typically 35mm to 45mm spacing depending on the variant). #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a "Phase Change" or high-performance thermal grease that fills microscopic air gaps between the heatsink and the chip, ensuring maximum heat transfer. --- ### 3. Thermal Performance Metrics Thermal resistance (measured in °C/W) determines how much the temperature of the chip rises per watt of power consumed. | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 10.79 | | 300 | 1.5 | 3.64 | | 500 | 2.5 | 2.51 | | 700 | 3.5 | 2.06 | --- ### 4. Application Use Cases This specific heatsink is generally found in: 1. **Networking Hardware:** Routers, switches, and modems. 2. **Embedded Systems:** Industrial PCs or IoT gateways. 3. **Power Electronics:** Voltage regulators or power converters that generate significant heat in a small footprint.