ATS-14D-56-C2-R0
AI

### Electronic Component Analysis: ATS-14D-56-C2-R0
The **ATS-14D-56-C2-R0** is a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series, designed for cooling specific electronic components like BGA (Ball Grid Array) packages, CPUs, or GPUs.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 6.56°C/W (at 1.0 m/s airflow) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 15mm |
| **Fin Style** | Straight Fin |
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### 2. Physical Design Features
The component is engineered for efficient heat dissipation within tight enclosures:
* **Straight Fin Design:** Provides a large surface area for heat exchange while maintaining a low pressure drop, making it ideal for systems with directed airflow.
* **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a mechanical push-pin system. This ensures a consistent, high-pressure contact between the heat sink and the chip, improving thermal transfer.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal pad that fills microscopic air gaps between the component and the heat sink.
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### 3. Thermal Performance Table
Thermal resistance varies based on the velocity of the air moving through the fins (measured in LFM - Linear Feet per Minute):
| Airflow Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **Unducted (0.5 m/s)** | 11.56 |
| **1.0 m/s** | 6.56 |
| **1.5 m/s** | 4.87 |
| **2.0 m/s** | 3.99 |
| **2.5 m/s** | 3.46 |
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### 4. Part Number Breakdown
Understanding the nomenclature helps in identifying variants:
* **ATS:** Advanced Thermal Solutions (Brand).
* **14D:** Series identifier (Push-pin style).
* **56:** Specific dimension/fin configuration.
* **C2:** Material/Finish code (Blue Anodized).
* **R0:** Revision or packaging code.
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- ⤷
What are the PCB hole requirements for mounting the ATS-14D-56-C2-R0?
- ⤷ Is this heat sink suitable for passive cooling without a fan?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?