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  • ATS-14D-56-C2-R0

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    ### Electronic Component Analysis: ATS-14D-56-C2-R0 The **ATS-14D-56-C2-R0** is a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series, designed for cooling specific electronic components like BGA (Ball Grid Array) packages, CPUs, or GPUs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 6.56°C/W (at 1.0 m/s airflow) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Fin Style** | Straight Fin | --- ### 2. Physical Design Features The component is engineered for efficient heat dissipation within tight enclosures: * **Straight Fin Design:** Provides a large surface area for heat exchange while maintaining a low pressure drop, making it ideal for systems with directed airflow. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a mechanical push-pin system. This ensures a consistent, high-pressure contact between the heat sink and the chip, improving thermal transfer. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal pad that fills microscopic air gaps between the component and the heat sink. --- ### 3. Thermal Performance Table Thermal resistance varies based on the velocity of the air moving through the fins (measured in LFM - Linear Feet per Minute): | Airflow Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted (0.5 m/s)** | 11.56 | | **1.0 m/s** | 6.56 | | **1.5 m/s** | 4.87 | | **2.0 m/s** | 3.99 | | **2.5 m/s** | 3.46 | --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS:** Advanced Thermal Solutions (Brand). * **14D:** Series identifier (Push-pin style). * **56:** Specific dimension/fin configuration. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or packaging code. ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for mounting the ATS-14D-56-C2-R0?
    • ⤷ Is this heat sink suitable for passive cooling without a fan?
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?