The **ATS-14D-66-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to their "blue ice" or high-performance push-pin series. Below is a detailed breakdown of its electronic and mechanical specifications. --- ### 1. General Specifications This part is designed to dissipate heat from surface-mount devices (SMDs) like CPUs, GPUs, or high-power transistors. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-14D-66-C2-R0 | | **Type** | Board Level Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the part fits within the PCB layout without interfering with other components. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height (Fin Height):** 35.00 mm * **Fin Style:** Straight Fin (optimized for airflow) --- ### 3. Thermal Performance Heat sinks are measured by their thermal resistance (expressed in °C/W). The lower the number, the better the cooling. | Airflow Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | **@ 1.0 m/s (200 LFM)** | ~5.77 °C/W | | **@ 2.0 m/s (400 LFM)** | ~2.36 °C/W | | **@ 3.0 m/s (600 LFM)** | ~1.58 °C/W | --- ### 4. Technical Features * **Push-Pin Mounting:** Uses a spring-loaded push-pin mechanism. This provides the necessary pressure for optimal thermal contact while making installation fast and tool-free. * **Material Science:** The aluminum construction offers a lightweight solution with high thermal conductivity. The Blue Anodized finish increases surface emissivity and protects against corrosion. * **Pre-applied TIM:** The "T766" phase-change material ensures that air gaps between the component and the heat sink are filled, maximizing heat transfer immediately upon installation. --- ### 5. Application Use Cases This specific model is typically found in: 1. **Networking Hardware:** Routers, switches, and base stations. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Dissipating heat from large MOSFETs or IGBT modules.