The **ATS-14D-67-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-14D-67-C2-R0 | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Pitch** | Fine Pitch (straight fin) | | **Thermal Resistance** | 20.30 °C/W (Unducted Flow @ 100 LFM) | --- ### 2. Key Features and Components #### **A. Thermal Interface Material (TIM)** This part typically comes with a pre-applied **Phase Change Material (PCM)** or a high-conductivity thermal pad. This ensures there are no air gaps between the chip surface and the heat sink, maximizing heat transfer. #### **B. Attachment Mechanism: pushPIN™** Instead of using messy adhesives or complicated screws, this part uses a **spring-loaded push-pin system**. * **Engagement:** The pins click into pre-drilled holes on the PCB. * **Constant Pressure:** The springs provide consistent downward force, which is critical for maintaining thermal contact under vibration or thermal expansion. #### **C. Fin Design** The "67" series features a specific fin density. A 10mm height indicates a **Low Profile** design, making it suitable for compact electronic enclosures (1U servers or thin embedded systems). --- ### 3. Thermal Performance Metrics Thermal resistance (measured in °C/W) determines how well the part moves heat away from the electronics. * **Low Airflow (100 LFM):** ~20.30 °C/W * **High Airflow (500 LFM):** ~4.20 °C/W *Note: Performance improves significantly as the velocity of the cooling air (from a fan) increases.* --- ### 4. Part Number Decoder Understanding the "R0" at the end: * **C2:** Refers to the thermal interface material (T766) and the blue anodized finish. * **R0:** Indicates the revision or specific packaging version of the product.