The **ATS-14D-68-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 15.31°C/W (Unducted Flow @ 100 LFM) | | **Weight** | 35 grams | --- ### 2. Key Components & Design Features #### A. Fin Profile (Straight Fin) The "68" in the part number identifies the specific fin pattern. This model typically features a **straight fin** design. Straight fins are ideal for systems with consistent airflow direction, providing a low pressure drop and high surface area for heat exchange. #### B. Push-Pin Mounting System Instead of using messy thermal adhesives or complex brackets, this part uses the **pushPIN™** system: * **Brass/Plastic Pins:** Secure the heat sink through pre-drilled holes in the PCB. * **Compression Springs:** Ensure consistent "Interface Pressure" against the chip, which optimizes heat transfer. #### C. Thermal Interface Material (TIM) The **C2** designation in the part number indicates that the heat sink comes pre-applied with **ATS-54** (a high-performance thermal grease). This eliminates the need for manual application and ensures no air gaps exist between the component and the heat sink. --- ### 3. Part Number Breakdown (Nomenclature) To understand what each segment of **ATS-14D-68-C2-R0** means: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **14:** Series (pushPIN™ Heat Sink). * **D:** Attachment Type (specific spring/pin configuration). * **68:** Fin Design/Pattern. * **C2:** Thermal Interface Material (ATS-54) and Finish (Blue Anodized). * **R0:** Revision/Standard packaging. --- ### 4. Typical Applications This heat sink is commonly found in: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PC boards. * **Power Electronics:** Voltage regulators and power modules.