ATS-14D-71-C2-R0
AI

The **ATS-14D-71-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to PCBs.
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### 1. Technical Specifications
The following table breaks down the physical and thermal properties of this specific part number:
| Property | Description / Value |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Base Part Number** | ATS-14D-71-C2-R0 |
| **Heat Sink Type** | Push-Pin |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 6.69°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm |
| **Attachment Method** | Push-Pin (Brass, 4.7mm OD) |
| **Thermal Interface (TIM)** | T766 (High Performance Phase Change) |
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### 2. Design Characteristics
The ATS-14D-71-C2-R0 is engineered for specific airflow conditions and mounting requirements:
* **Finned Pattern:** It utilizes a **cross-cut** or **pin-fin** design. This allows for multi-directional airflow, making it more efficient in systems where the direction of the air intake might fluctuate.
* **Attachment Mechanism:** The "Push-Pin" system uses a pre-assembled spring-loaded pin. This provides consistent pressure on the component (CPU, GPU, or FPGA) to maximize thermal transfer while preventing damage from over-tightening.
* **Material Choice:** Aluminum is used for its excellent weight-to-thermal-conductivity ratio, and the Blue Anodized finish prevents oxidation while slightly improving radiative heat transfer.
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### 3. Thermal Performance Profile
The efficiency of this heat sink depends heavily on the Linear Feet per Minute (LFM) of airflow:
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 | 6.69 |
| 200 | 2.50 |
| 300 | 1.40 |
| 500 | 0.88 |
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### 4. Part Number Breakdown (Naming Convention)
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Manufacturer) |
| **14** | Attachment Series (Push-Pin) |
| **D** | Material / Process Code |
| **71** | Size/Design Identifier |
| **C2** | Thermal Interface Material (T766) |
| **R0** | Revision / RoHS Compliance Status |
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What is the difference between T766 and other thermal interface materials used in ATS heat sinks?
- ⤷ How do I calculate the required LFM for my specific chip wattage?
- ⤷ Are there alternative mounting options if push-pins are not supported on my PCB?