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  • ATS-14D-71-C2-R0

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    The **ATS-14D-71-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to PCBs. --- ### 1. Technical Specifications The following table breaks down the physical and thermal properties of this specific part number: | Property | Description / Value | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Part Number** | ATS-14D-71-C2-R0 | | **Heat Sink Type** | Push-Pin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 6.69°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Attachment Method** | Push-Pin (Brass, 4.7mm OD) | | **Thermal Interface (TIM)** | T766 (High Performance Phase Change) | --- ### 2. Design Characteristics The ATS-14D-71-C2-R0 is engineered for specific airflow conditions and mounting requirements: * **Finned Pattern:** It utilizes a **cross-cut** or **pin-fin** design. This allows for multi-directional airflow, making it more efficient in systems where the direction of the air intake might fluctuate. * **Attachment Mechanism:** The "Push-Pin" system uses a pre-assembled spring-loaded pin. This provides consistent pressure on the component (CPU, GPU, or FPGA) to maximize thermal transfer while preventing damage from over-tightening. * **Material Choice:** Aluminum is used for its excellent weight-to-thermal-conductivity ratio, and the Blue Anodized finish prevents oxidation while slightly improving radiative heat transfer. --- ### 3. Thermal Performance Profile The efficiency of this heat sink depends heavily on the Linear Feet per Minute (LFM) of airflow: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 6.69 | | 200 | 2.50 | | 300 | 1.40 | | 500 | 0.88 | --- ### 4. Part Number Breakdown (Naming Convention) | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **14** | Attachment Series (Push-Pin) | | **D** | Material / Process Code | | **71** | Size/Design Identifier | | **C2** | Thermal Interface Material (T766) | | **R0** | Revision / RoHS Compliance Status |
    ✨ Follow-up Questions
    • ⤷ What is the difference between T766 and other thermal interface materials used in ATS heat sinks?
    • ⤷ How do I calculate the required LFM for my specific chip wattage?
    • ⤷ Are there alternative mounting options if push-pins are not supported on my PCB?