The **ATS-14D-75-C1-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material** | ATS-CPT (Pre-applied Phase Change Material) | | **Fin Style** | Straight Fin | --- ### 2. Design and Engineering Features ### A. Fin Geometry (Straight Fin) The "Straight Fin" design is optimized for **forced air cooling** environments. The spacing between the fins is engineered to provide a balance between surface area for heat exchange and low pressure drop for the airflow provided by system fans. ### B. Attachment Mechanism: pushPIN™ This part uses a mechanical push-pin system rather than adhesive. This provides several benefits: * **Constant Pressure:** The springs ensure consistent contact between the heatsink and the component. * **Secure Mounting:** Prevents the heatsink from shifting during vibration or shipping. * **Ease of Installation:** Uses pre-drilled holes in the PCB for rapid assembly. ### C. Thermal Interface Material (TIM) The part comes with **ATS-CPT** pre-applied to the base. This is a high-performance thermal material that fills microscopic air gaps between the heatsink and the electronic component, significantly reducing thermal resistance. --- ### 3. Thermal Performance Indicators Performance is measured by **Thermal Resistance** (°C/W). Lower values indicate better heat dissipation: * **Unducted Flow (200 LFM):** ~14.95 °C/W * **Ducted Flow (200 LFM):** ~1.70 °C/W *Note: Performance varies significantly based on the Airflow (LFM - Linear Feet per Minute) within the enclosure.* --- ### 4. Typical Applications * **Network Switches/Routers:** Cooling high-speed processing chips. * **Embedded Systems:** Industrial PCs where reliability is critical. * **Power Supplies:** Cooling MOSFETs or power ICs.