## Technical Analysis: ATS-14D-77-C2-R0 The **ATS-14D-77-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It belongs to the **maxiFLOW™** product line, designed for cooling high-power semiconductors like CPUs, GPUs, and FPGAs. --- ### 1. General Specifications The part is designed for high-efficiency heat dissipation in constrained environments. Below are the primary mechanical and thermal properties: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-14D-77-C2-R0 | | **Type** | Top Mount Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 9.30°C/W @ 100 LFM | --- ### 2. Physical Dimensions Precision sizing is critical for board layout and component clearance. * **Length (A):** 45.00 mm * **Width (B):** 45.00 mm * **Height (C):** 30.00 mm * **Pitch (E):** 38.00 mm (Distance between mounting holes) * **Pitch (F):** 38.00 mm --- ### 3. Key Electronic/Thermal Features #### A. Thermal Performance Data Thermal resistance indicates how effectively the part moves heat away from the electronics. Lower values are better at higher airflows. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 9.30 | | 200 (1.0 m/s) | 5.11 | | 300 (1.5 m/s) | 3.91 | | 400 (2.0 m/s) | 3.30 | #### B. The pushPIN™ Attachment System This part uses the proprietary **pushPIN™** system, which is crucial for reliability in electronics: * **Pre-assembled Springs:** Ensures a precise pressure (Pre-load) is applied to the component, preventing damage to the silicon die. * **Flexible Options:** The "R0" at the end typically indicates the specific spring and plastic pin combination for standard PCB thicknesses. #### C. Phase Change Material (TIM) The "C2" in the part number indicates the **Thermal Interface Material (TIM)**. This is the pre-applied "gray" material on the base of the heat sink that fills microscopic air gaps between the heat sink and the chip to improve heat transfer. --- ### 4. Typical Applications This component is found in the following electronic sectors: * **Telecommunications:** Cooling for high-speed routers and switches. * **Data Centers:** Server blade processors. * **Industrial Power:** Power supplies and motor controllers. * **Embedded Systems:** Single-board computers requiring active or passive airflow. ---