## Electronic Specifications: ATS-14D-83-C2-R0 The **ATS-14D-83-C2-R0** is a high-performance push-pin heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for cooling electronic components, typically integrated circuits (ICs), BGAs, and processors. --- ### 1. Key Technical Specifications The following table highlights the physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-14D-83-C2-R0 | | **Heat Sink Type** | Push-Pin (High Performance) | | **Material** | Aluminum (Blue Anodized) | | **Fin Style** | Straight Fin | | **Dimensions (L x W x H)** | 30mm x 30mm x 20mm | | **Thermal Resistance** | 16.03° C/W (@ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Attachment Method** | Plastic Push-Pin (Brass Spring) | --- ### 2. Thermal Performance Data Thermal resistance measures how effectively the heat sink dissipates heat into the surrounding air. Lower values indicate better performance. * **Unducted Flow (LFM = Linear Feet per Minute):** * **@ 100 LFM:** 16.03° C/W * **@ 200 LFM:** 8.25° C/W * **@ 400 LFM:** 4.66° C/W * **@ 600 LFM:** 3.50° C/W --- ### 3. Electronic Design Features * **Attachment Mechanism:** It utilizes a **push-pin** system with a compression spring. This ensures consistent pressure between the heat sink and the electronic component, which is critical for maximizing heat transfer. * **Thermal Interface Material (TIM):** The unit comes with **T766** pre-applied. T766 is a phase-change material that fills microscopic air gaps between the component and the heat sink. * **Fin Density:** The straight-fin design is optimized for environments with a defined airflow direction, allowing for efficient heat dissipation in forced-convection systems. * **Material Compatibility:** The blue anodized aluminum offers high thermal conductivity while providing a durable, corrosion-resistant finish. --- ### 4. Implementation Checklist When integrating the ATS-14D-83-C2-R0 into a PCB design, consider the following: 1. **Hole Pattern:** Ensure the PCB has the correct hole diameters and spacing to accommodate the push-pins. 2. **Component Height:** Verify that the 20mm height does not interfere with other daughterboards or the chassis lid. 3. **Airflow Direction:** Align the straight fins parallel to the system's airflow to achieve the thermal resistance values listed above. ---