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  • ATS-14D-84-C2-R0

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    ### Technical Overview: ATS-14D-84-C2-R0 The **ATS-14D-84-C2-R0** is a high-performance electronic cooling component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Key Technical Specifications The following table outlines the mechanical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Dimensions (L x W)** | 30.00mm x 30.00mm | | **Height (Height Off Base)** | 25.00mm | | **Pitch** | Fine-Pitch | | **Thermal Resistance** | 7.00°C/W (at 100 LFM) | --- ### 2. Design Components The "Electronic Parts" aspect of this assembly consists of three main elements: 1. **The Heat Sink Body:** A square aluminum block with a **straight fin** design. The fine-pitch arrangement maximizes surface area for air contact, improving heat transfer efficiency. 2. **The Attachment (Push-Pin):** Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin mechanism. This provides consistent pressure (TIM compression) and allows for easy installation or removal without damaging the PCB. 3. **Thermal Interface Material (TIM):** The part usually comes with a pre-applied high-performance thermal interface material (like T766) on the base to ensure there are no air gaps between the heat source and the aluminum. --- ### 3. Thermal Performance Data Thermal resistance measures how effectively the part moves heat. Lower numbers indicate better cooling performance. * **@100 LFM (0.5 m/s):** 7.00 °C/W * **@200 LFM (1.0 m/s):** 2.82 °C/W * **@500 LFM (2.5 m/s):** 1.48 °C/W --- ### 4. Applications This part is typically found in: * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Routers and switches. * **Power Supplies:** Cooling voltage regulators or MOSFETs. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between blue anodized and black anodized finishes for heat sinks?
    • ⤷ How do I calculate the required LFM for my specific processor?
    • ⤷ Are there alternative mounting options if my PCB lacks push-pin holes?