## Technical Overview: ATS-14D-87-C2-R0 The **ATS-14D-87-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the *pushPIN™* series, designed for efficient heat dissipation in integrated circuits (ICs) and other electronic components. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-14D-87-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 13.12 °C/W (Unducted Flow @ 100 LFM) | | **Dimension (Length/Width)** | 35.00 mm x 35.00 mm | | **Height** | 15.00 mm | | **Weight** | ~40.00 grams | --- ### 2. Component Design Details #### A. Fin Pattern (Straight Fin) The "87" in the part number indicates a specific fin density and geometry. This model typically utilizes a **Straight Fin** design. * **Advantage:** Provides a low-pressure drop and is ideal for systems with high-velocity airflow. * **Airflow Orientation:** Works best in systems where airflow is directed parallel to the fins. #### B. Attachment Mechanism (pushPIN™) The "ATS-14D" prefix refers to the specific attachment kit. * **Pre-assembled:** It comes with a brass or plastic pushPIN and a compression spring. * **Thermal Interface Material (TIM):** The "-C2" suffix indicates that the heat sink comes pre-applied with **ATS-PPS-11**, a high-performance thermal grease, ensuring immediate installation readiness. #### C. Material and Coating * **Aluminum 6063:** Chosen for its balance of thermal conductivity and weight. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer increases surface emissivity, slightly improving radiation heat transfer and protecting the aluminum from corrosion. --- ### 3. Thermal Performance Analysis Thermal resistance measures how effectively the part moves heat away from the semiconductor. | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 13.12 | 4.57 | 2.58 | 1.81 | 1.45 | *Note: Performance significantly improves as airflow (Linear Feet per Minute) increases.* --- ### 4. Application Use-Cases * **BGA Cooling:** Ideal for Ball Grid Array (BGA) processors. * **Embedded Systems:** Used in compact industrial PCs where vertical space is limited to 15mm. * **Telecommunications:** Cooling for line cards and networking switches.