The **ATS-14D-90-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to PCBs. --- ### 1. Component Specifications Below is a technical breakdown of the part based on its nomenclature and data sheet: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-14D-90-C2-R0 | | **Heat Sink Type** | Push-pin Heat Sink | | **Material** | Aluminum (Blue Anodized Finish) | | **Fin Type** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (High Performance) | | **Dimensions** | 35mm x 35mm x 25mm | | **Attachment Method** | Brass Push-Pin (Spring Loaded) | --- ### 2. Physical Design Details The design of this component is optimized for air cooling within electronic enclosures: * **Geometry:** It features a square footprint (35mm) with a height of 25mm. The vertical fins provide a large surface area to dissipate heat from the underlying semiconductor. * **Attachment Mechanism:** It uses a **Push-pin** system with a compression spring. This provides a consistent "clamping force" against the chip, ensuring the thermal interface material makes solid contact. * **Material Choice:** Aluminum is used for its high thermal conductivity-to-weight ratio. The **Blue Anodized** coating improves radiation heat transfer and prevents corrosion. --- ### 3. Thermal Performance Thermal resistance is critical for determining if this part can keep a specific chip (like a CPU, FPGA, or GPU) within safe operating temperatures. * **Thermal Resistance (Unducted):** Approximately **6.36 °C/W** at low airflow (200 LFM). * **Thermal Resistance (Ducted):** Performance improves significantly with forced air (fan), dropping as low as **1.60 °C/W** at 800 LFM. --- ### 4. Typical Applications This specific model is commonly found in: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Power Supplies:** Managing heat on MOSFETs or power regulators. 3. **Industrial Controls:** Cooling components in rugged environments where vibration resistance (offered by push-pins) is necessary.