The part number **ATS-14D-91-C2-R0** refers to a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). This component belongs to the "maxiFLOW™" series, specifically designed for cooling electronic components like BGA (Ball Grid Array) packages. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Heat Sink Type** | maxiFLOW™ | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Thermal Resistance (Unducted)** | 21.97 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 3.63 °C/W | | **Compatibility** | BGA, Square Chipsets | --- ### Component Breakdown #### 1. Thermal Management (The Core Function) The primary role of this part is to dissipate heat away from a semiconductor device. It uses a **fine-pitch fin design** which increases the surface area, allowing air to carry away heat more efficiently. The "maxiFLOW" geometry is specifically engineered to maximize airflow across the base. #### 2. Attachment Mechanism: pushPIN™ Unlike adhesive-based heat sinks, this model uses a **pushPIN™** system: * **Brass/Plastic Pins:** Used to secure the sink to the PCB. * **Compression Springs:** These provide a precise "force-to-load" ratio, ensuring the heat sink stays in firm contact with the chip without cracking the silicon or the solder balls. #### 3. Material and Coating * **Aluminum:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization increases the emissivity of the surface (helping with radiant cooling) and provides a protective layer against corrosion. #### 4. Thermal Interface Material (TIM) The "R0" at the end of the part number typically signifies the inclusion of a pre-applied **Phase Change Material** or thermal tape. This fills the microscopic air gaps between the chip and the heat sink base to ensure maximum heat transfer. --- ### Deciphering the Part Number | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **14** | Series / Attachment Style (pushPIN™) | | **D** | Material / Special Characteristics | | **91** | Specific Model / Fin Configuration | | **C2** | Color/Finish (Blue Anodized) | | **R0** | Thermal Interface Material (Pre-applied) |