The part number **ATS-14D-92-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" heat sink line designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary mechanical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 16.48°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 15.00mm | | **Fin Style** | Straight Fin | | **Pressure Support** | High Performance (Compression Spring) | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS-14**: Refers to the "push-pin" attachment series. * **D**: Indicates the spring type or specific mechanical variation. * **92**: The specific die/mold profile and footprint size. * **C2**: Refers to the **Thermal Interface Material (TIM)** provided. In this case, it usually comes with T766 or a similar high-performance phase-change material/grease. * **R0**: Indicates the revision level or packaging standard. --- ### 3. Key Electronic Applications This part is used to manage the thermal load of discrete electronic components. Without a heatsink, the junction temperature of a semiconductor can exceed safety limits, leading to "thermal throttling" or permanent failure. * **Integrated Circuits (ICs):** Specifically BGA (Ball Grid Array) packages. * **Power Electronics:** Cooling MOSFETs or Voltage Regulators in compact enclosures. * **Embedded Systems:** Used in industrial PCs where airflow is provided by a system fan. --- ### 4. Installation Design The electronic PCB must have pre-drilled holes to accommodate the push-pins. The design utilizes: 1. **Plastic Push-Pins:** To snap through the PCB. 2. **Compression Springs:** To ensure a precise "clamping force" is applied to the chip, maximizing heat transfer without cracking the silicon die.