The **ATS-14D-93-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The model number encodes specific physical and thermal characteristics: | Property | Detail | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 1.23°C/W (at 200 LFM) | | **Dimensions** | 40mm x 40mm x 20mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Component Breakdown #### A. The Heat Sink Body The "93" in the part number refers to the specific fin pattern. This model typically features a **Straight Fin** design, which provides a large surface area for heat dissipation. The blue anodized coating is not just for aesthetics; it increases surface emissivity and protects the aluminum from corrosion. #### B. The Push-Pin Attachment Instead of using adhesive tape (which can fail under heat) or screws (which require backplates), this part uses a **plastic or brass push-pin mechanism**. * **Reliability:** Ensures consistent pressure against the component. * **PCB Compatibility:** Requires pre-drilled holes in the PCB (usually 3.0mm diameter). #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a phase-change material that fills microscopic air gaps between the heatsink and the chip, significantly reducing thermal resistance compared to air. --- ### 3. Thermal Performance Profile Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural) | 7.37 | | 200 (Low Fan) | 1.23 | | 400 (High Fan) | 0.84 | --- ### 4. Typical Applications This specific size (40x40mm) is commonly used for: * **Northbridge/Southbridge** chips on motherboards. * **FPGAs** (Field Programmable Gate Arrays) in industrial equipment. * **High-speed networking switches** and routers. * **Power Converters** requiring active air cooling.