The **ATS-14D-98-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ICECUBE" series, designed for cooling high-power semiconductors like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Base Dimensions** | 45mm x 45mm | | **Height** | 20mm | | **Fin Style** | Straight Fin (Cross-cut) | | **Thermal Resistance** | 15.31°C/W (at 1.0 m/s airflow) | | **Finish** | Blue Anodized | --- ### 2. Key Components & Design Features #### A. The pushPIN™ Attachment System Unlike adhesive tapes or simple clips, the `C2` designation indicates a specialized attachment system: * **Compression Springs:** Provide a precise, consistent "Force" (Pressure) against the electronic component. * **Plastic Push Pins:** Snap into pre-drilled holes in the PCB, ensuring the heat sink does not shift during vibration or transport. #### B. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides electrical insulation and improves surface emissivity, aiding in heat radiation. #### C. Thermal Interface Material (TIM) * **Pre-Applied T766:** The unit usually comes with a high-performance Phase Change Material (PCM) or thermal grease pre-applied to the base, ensuring there are no air gaps between the chip and the heat sink. --- ### 3. Application Use-Cases The ATS-14D-98-C2-R0 is typically found in: * **Networking Equipment:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Cooling MOSFETs and voltage regulators. --- ### 4. Thermal Performance Data *Measured in °C/W (Degrees Celsius per Watt of heat dissipated):* | Airflow Velocity (LFM) | Thermal Resistance (Unducted) | | :--- | :--- | | 1.0 m/s (200 LFM) | 15.31 °C/W | | 2.0 m/s (400 LFM) | 6.81 °C/W | | 3.0 m/s (600 LFM) | 4.61 °C/W |