The part number **ATS-14E-101-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "superGRIP" series, designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Fin Type** | Straight Fin | | **Length/Width** | 45mm x 45mm | | **Height** | 30mm | | **Thermal Resistance** | 6.69°C/W (at 200 LFM) | | **Attachment Method** | superGRIP (Clip-on) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **14E**: Refers to the specific series and frame attachment style (superGRIP). * **101**: Unique identifier for the dimensions and fin configuration. * **C2**: Indicates the material/finish (Blue Anodized Aluminum). * **R0**: Refers to the revision code or packaging standard. --- ### 3. Key Electronic Functions While a heat sink is a passive mechanical component, it is critical for electronic reliability: 1. **Thermal Management**: It increases the surface area of a semiconductor package, allowing heat to dissipate into the surrounding air via convection. 2. **Overheating Protection**: By maintaining a lower junction temperature, it prevents thermal throttling and extends the Mean Time Between Failures (MTBF) of the electronic chip. 3. **EMI Shielding (Partial)**: Because it is a grounded metal mass (when properly mounted), it can sometimes assist in reducing electromagnetic interference (EMI). --- ### 4. Installation Design This specific model uses the **superGRIP** attachment system, which is highly valued in PCB assembly for several reasons: * **No Holes Required**: It clips directly onto the component's edges, meaning no holes need to be drilled into the PCB. * **High Tension**: Provides consistent pressure on the Thermal Interface Material (TIM) for maximum heat transfer. * **Space Efficient**: The thin clip frame allows for components to be placed tightly together on the motherboard. ---